3D Printed


EIE Microcontroller Application Design Contest (2018-19)



With a view to promote students’ interest in microcontroller-based electronic product design and to provide a platform for students to exercise their creativity and innovation through teamwork, the EIE Department will organize “EIE Microcontroller Application Design Contest (2018-19)” jointly with RS Components Ltd., EGG Technologies Ltd. and 3D Printed Prosthetics. EIE and other PolyU students who participate in this contest may win a HK$500 prize by creating microcontroller-based devices in different areas such as Internet of Things (IoT), sensor network, system control, etc. Following are some examples:





This contest is jointly organized by EIE, RS Components Ltd. (RS), EGG Technologies Ltd. (EGG) and 3D Printed Prosthetics. RS is the world's largest high-service distributor of electronics and maintenance products. EGG is a local technology company, while 3D Printed Prosthetics is a social enterprise with 3D printing technology and skills. Successful participants shortlisted in Phase I (see below) will be supported by RS who will provide all electronic components used in the projects through their online web site. Moreover, they are encouraged to use DesignSpark PCB or/and DesignSpark Mechanical (software provided by RS) to design and implement their products. Furthermore, RS may offer summer internship to selected winners while EGG mainly sponsors the prizes.


Conditions and Schedule of the Contest


There are two phases in this contest:


Phase I (Deadline: 5:00 pm, 5 December 2018):


  • Contest participants submit an application form (in PDF format) to (1) describe  the features and design of your product, and (2) list all components you need from RS company to build your product. The proposal should use 12-point fonts and single-line spacing, and should be within eight A4 pages with everything included. A sample proposal can be found in Blackboard. Note that the estimated costs which should not be more than HK$2,000.
  • A briefing session will be provided by RS company in CF004 from 4:30 pm to 6 pm on 4 December 2018 (Tuesday). The briefing session will include the following content:
    • A workshop for DesignSpark Mechanical (provided by RS). This tool is very useful to build up your product.
    • A tutorial to show how to get components from RS online web site and name them correctly in the application form.
    • A group discussion to share contest participants’ idea and some feedback will be given to participants to write good proposals. Note that it will be much better if contest participants can prepare a draft proposal before they join the group discussion (one to two pages will be fine).
  • Contest participants submit a proposal to Blackboard on or before the deadline.


Phase II (Deadline: 8 February 2019):


  • Shortlisted contest participants will receive financial support and technical advice/support from the EIE Department and RS Components Ltd. to implement their products based on their proposals. They will have eight weeks to design and implement their products.
  • There are two progress meetings. Contest participants are required to join such meetings and report their progress in the meetings.
  • At the end, contest participants will deliver their final design/products and give a 20-minute presentation (15 minutes for presentation and 5 minutes for Q & A) to describe and demonstrate the features of their final products.


Major Event and Date/Deadline


  • Briefing session with RS (Phase I): 4:30 pm – 6:00 pm, 4 December 2018 (Tuesday), venue: CF004
  • Proposal submission (Phase I): 5:00 pm, 5 December 2018 (Wednesday)
  • Announce the shortlisted participants to Phase II: 10 December 2018 (Monday)
  • Collect the components: 21 December 2018 (Friday)
  • 3D Printing Workshop: 21 December 2018 afternoon (Friday)
  • Final product submission (Phase II): 8 February 2019 (Friday)
  • Presentation and Q & A sessions (Phase II): 15 February 2019 (Friday, evening) (Time and venue will be confirmed later. Welcome all students to join and the results will be announced after presentation)




a. All current EIE students.


b. Students may form group of one to three members, among them:


  • at least one of them is current EIE student for group of one/two;
  • at least two of them are current EIE students for group of three;


while others can be current PolyU students from different departments/divisions.


c. All participants should share their projects onto DesignSpark, EGG Technologies Ltd. and 3D Printed Prosthetics webpages/Facebook. Photos will be taken during the presentation of final designs/products and interview videos with participants will be arranged. Such photos and videos will be posted to DesignSpark, EGG Technologies Ltd. and 3D Printed Prosthetics webpages/Facebook.


Judgment Criteria


a. Phase I


The proposal will be judged by:

  • Innovation
  • Usefulness


b. Phase II


The product will be judged by:

  • Innovation
  • Novelty
  • Functionality
  • Workmanship


The panel of judges of the two phases will consist of academic staff members of the EIE Department and may also include representative(s) from RS, EGG and 3D Printed Prosthetics. The decision of the panel will be final.




1st Prize: HK$500 with certificate and summer internship opportunities at RS

2nd Prize(s): HK$200 with certificate

3rd Prize(s): HK$100 with certificate

Merit Prize(s): certificate

Outlook Prize: 3D design + PCB design

  • Champion: HK$100 + certificate
  • Merit(s): certificate


Notes for Participants

a. The proposals and the final products should be original.

b. For enquiry, please contact Dr. Lawrence Cheung by email: .




Department of Electronic and Information Engineering



RS Components Ltd.

EGG Technologies Ltd.

3D Printed Prosthetics