EIE Microcontroller Application Design Contest (2018 - 19)
GUIDELINES AND REFERENCE MATERIALS
DesignSpark Mechanical (3D)
EIE Microcontroller Application Design Contest (2018-19)
With a view to promote students’ interest in microcontroller-based electronic product design and to provide a platform for students to exercise their creativity and innovation through teamwork, the EIE Department will organize “EIE Microcontroller Application Design Contest (2018-19)” jointly with RS Components Ltd., EGG Technologies Ltd. and 3D Printed Prosthetics. EIE and other PolyU students who participate in this contest may win a HK$500 prize by creating microcontroller-based devices in different areas such as Internet of Things (IoT), sensor network, system control, etc. Following are some examples:
This contest is jointly organized by EIE, RS Components Ltd. (RS), EGG Technologies Ltd. (EGG) and 3D Printed Prosthetics. RS is the world's largest high-service distributor of electronics and maintenance products. EGG is a local technology company, while 3D Printed Prosthetics is a social enterprise with 3D printing technology and skills. Successful participants shortlisted in Phase I (see below) will be supported by RS who will provide all electronic components used in the projects through their online web site. Moreover, they are encouraged to use DesignSpark PCB or/and DesignSpark Mechanical (software provided by RS) to design and implement their products. Furthermore, RS may offer summer internship to selected winners while EGG mainly sponsors the prizes.
Conditions and Schedule of the Contest
There are two phases in this contest:
Phase I (Deadline: 5:00 pm, 5 December 2018):
Phase II (Deadline: 8 February 2019):
Major Event and Date/Deadline
a. All current EIE students.
b. Students may form group of one to three members, among them:
while others can be current PolyU students from different departments/divisions.
c. All participants should share their projects onto DesignSpark, EGG Technologies Ltd. and 3D Printed Prosthetics webpages/Facebook. Photos will be taken during the presentation of final designs/products and interview videos with participants will be arranged. Such photos and videos will be posted to DesignSpark, EGG Technologies Ltd. and 3D Printed Prosthetics webpages/Facebook.
a. Phase I
The proposal will be judged by:
b. Phase II
The product will be judged by:
The panel of judges of the two phases will consist of academic staff members of the EIE Department and may also include representative(s) from RS, EGG and 3D Printed Prosthetics. The decision of the panel will be final.
1st Prize: HK$500 with certificate and summer internship opportunities at RS
2nd Prize(s): HK$200 with certificate
3rd Prize(s): HK$100 with certificate
Merit Prize(s): certificate
Outlook Prize: 3D design + PCB design
Notes for Participants
a. The proposals and the final products should be original.
b. For enquiry, please contact Dr. Lawrence Cheung by email: firstname.lastname@example.org .
Department of Electronic and Information Engineering
RS Components Ltd.
EGG Technologies Ltd.
3D Printed Prosthetics